即裸片级封装(Die Level)、器件宣传册印刷时怎么排级封装(Device Level)、硅圆片东莞石排印刷厂级封装(Wafer Lever Packaging)、单芯排产单片封装(Single Chip Packaging)和系统排产计划级封装(Sy...
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系统级封装 SIP ; system in package ; RF-SiP
晶圆级封装 WLP ; Wafer Level Package ; wafer-level packaging
芯片级封装 CSP ; Chip Scale Package ; Chip Scale Packaging ; Intel UT-SCSP
晶片级封装 WLP ; UCSP ; Wafer Level Packaging ; chip scale package
圆片级封装 WLP ; wafer level package ; MCP
引脚架构芯片级封装 LFCSP
扇出型晶圆级封装 Fan-out WLP ; Fan-Out Wafer Level Package ; fo-wlp
晶圆芯片级封装 WCSP
引线框芯片级封装 LFCSP
一级封装中最流行的互连技术仍为丝焊。
Wire bonding is still the most popular interconnect technology in the first-level packaging.
它们可以分为圆片级封装、芯片级封装、和封装面。
They can be classified into wafer level, chip level, and package level stacking.
设计并制作了一种基于LTCC技术的系统级封装多通道射频前端电路。
A system in package(SIP) RF front-end based on LTCC technology was designed, fabricated and tested.
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