...签： Autotalks 探索蓝牙、蜂巢式物联网SoC 装置中常见的三种蓝牙SoC比较 （来源：TechInsights）系统级封装(System in Package；SiP)是用于许多物联网装置中的另一种解决方案。
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以系统级封装 System-in-Package ; System in a Package ; SIP ; System in Chip
以供系统级封装 System-in-Package ; SIP
射频系统级封装 rf sop ; RF SIP ; RF System-in-Pack-age
系统级封装产品 System in Package product
系统级封装设计 System in Package designing
指纹辨识系统级封装 FP SiP
作为系统级封装 System-In-Package ; SIP
系统级封装技术 System-In-Package ; System in Packaging ; SIP
在系统级封装 System in a Package ; SIP
·2,447,543篇论文数据，部分数据来源于NoteExpress
设计并制作了一种基于LTCC技术的系统级封装多通道射频前端电路。
A system in package(SIP) RF front-end based on LTCC technology was designed, fabricated and tested.
系统级的凝聚特征将设计知识、几何形状以及联接关系等封装起来，克服了传统特征在功能语义表达上的不完备性。
Encapsulating design knowledge, geometry form and conjunction relationship, the agglomerated feature in system-level is generated to maintain the whole semantic elements of a function.
该软件可用于封装，电路板及系统级CFD模拟，包括自然对流、强制对流和辐射传热。
This software can be used for package -, board - or system-level CFD simulation, including natural and forced convection and radiation heat transfer.
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