Wafer bonding technology is a process that two clean and flat wafers are jointed with chemical bonds on wafer surfaces in a required condition.
两个表面平整洁净的硅片在一定条件下可以通过表面的化学键互相连接起来,这就是硅硅直接键合技术。
参考来源 - 硅硅直接键合的理论及工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
器件采用微电子机械加工技术和键合技术研制。
The two parts are fabricated by MEMS technology and combined as aw.
报道了一种利用硅乳胶作为键合介质的新型键合技术。
A novel bonding method using silicate gel as bonding medium is developed.
本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。
In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation.
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