...工；底部填充料；环氧树脂；倒装芯片；热降解 [gap=1200]Key words：reworkable；underfill materials；diepoxide；flip - chip；thermal degradation ...
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Flip chip 倒装芯片 ; 覆晶技术 ; 覆晶
flip chip bonder 倒装焊接机 ; 倒装片接合机 ; 设备 ; 覆晶固晶机
flip chip bonding 倒装焊接 ; 侧装片接合 ; 倒装焊
flip chip bump 倒装芯片隆起焊盘 ; 倒装片凸点
flip-chip bonding 倒装芯片安装 ; 倒装晶片安装
flip chip carrier 倒装芯片座
flip-chip 倒装式芯片 ; 倒装片 ; 晶片反转 ; 倒装焊
Flip Chip Substrate 覆晶基板 ; 覆晶载板
Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
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