...:在电子制造行业,随着产品性能的不断提高,对表面质量的要求越来越高。抛光是表面平整化加工的重要手段。与现有的抛光技术相比,化学机械抛光(Chemical mechanical polishing,简称CMP)是目前广泛采用的并且是几乎唯一的全局平面化技术。
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... Chemically-Polish :化学抛光 Chemmically-Mechanically Polish (CMP):化学机械抛光 Chip :芯片 ...
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CMP(展板形式) 化学机械抛光(Chemical Mechanical Planarization,CMP)是集成电路生产线中的核心工艺之一,技术难度仅次于光刻技术。
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抛光垫修整是化学机械抛光的重要过程之一。
Polishing pad conditioning is very important for chemical mechanical polishing to improve the performances of a pad.
抛光垫是化学机械抛光(CMP)系统的重要组成部分。
Polishing pad is a very important component of the chemical-mechanical polishing (CMP) system.
着重分析了铜化学机械抛光的抛光过程和相关的影响因素;
The polishing processes of copper CMP and its influence factors were introduced.
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