重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
本发明公开了一种无铅无卤素锡焊膏,包括以下重量份组分:合金粉 80-98,助焊剂2-20;
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
丝网印刷在双面印年刷电路板( PCB)工艺中起着重要作用,最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量,要做到这一点,需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
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