阐述了国内外免清洗焊剂和无铅焊锡膏的研究现状及其在电子组装技术中的应用前景。
The research on and the application in the electronic assembly technology of the two materials are reviewed.
三种焊锡膏均可形成饱满、光亮的焊点，锡铅焊点外观比无铅焊点更规整圆滑。
All of the three solder pastes could form plump and splendid solder point, and the appearance of Sn-Pb solder point was more regular and sleek.
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