重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
本发明公开了一种无铅无卤素锡焊膏，包括以下重量份组分：合金粉 80-98，助焊剂2-20；
The invention discloses a leadless and no-halogen tonal, comprising following components with percent by weight: alloy powder 80-98 and welding flux 2-20;
丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
最明显的是，使用无铅锡膏必须提高回流焊温度。
The most obvious is the necessity for increased reflow temperature.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
当焊盘面积大于孔壁表面积的66%。提高锡膏有效转移的可能性。
When the pad area is greater than 66 percent of the aperture wall surface area, the probability of achieving efficient paste transfer is increased.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。
Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
应用推荐