随着集成电路(IC)制造技术的飞速发展，为了进一步增加IC芯片的产量和降低单元制造成本，硅片趋向大直径化。

With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.

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基于自动成像和便捷的图像化操作界面，针对碎裂硅片ADT提供了独特的处理和编程功能。

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

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硅料、硅片生产重要配套项目：如高纯度石英粉产业化项目、切割液、碳化硅、切割线、带锯等。

To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.

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