随着集成电路(IC)制造技术的飞速发展，为了进一步增加IC芯片的产量和降低单元制造成本，硅片趋向大直径化。
With the fast development of IC manufacturing technology, the diameter of the silicon wafer trends to be larger in order to increase the yields of chips and reduce the cost per bit.
基于自动成像和便捷的图像化操作界面，针对碎裂硅片ADT提供了独特的处理和编程功能。
Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.
硅料、硅片生产重要配套项目：如高纯度石英粉产业化项目、切割液、碳化硅、切割线、带锯等。
To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.
一个硅片便可包容的微处理器是一种微型化电子电路产品。
The microprocessor, which can be contained on a single silicon chip, is a product of the microminiaturization of electronic circuitry.
在此详细介绍了DIP - CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
在此详细介绍了DIP - CIB模块的内部电路、半导体硅片技术、封装技术，以及如何配合专用的HVIC来实现通用变频器的小型化设计。
This paper describes the internal circuit of the DIP-CIB module, semiconductor chip technologies, package technologies and general purpose inverter design by using HVIC and the DIP-CIB module.
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