分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
分析了石墨微晶结构与成键特征，研究了石墨微晶中边缘碳原子与基平面碳原子的电化学特性。
The electrochemical characteristics of carbon atoms on the edge and basal plane were determined by analyzing structure of graphite crystal and bond of different carbon atoms.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
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