每粒晶片键合电极面朝上装在粘性膜上。
Each pellet is mounted on an adhesive sheet with wire-bonded electrode side up.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
所有芯片制造厂都使用类似的设备，包括深反应离子蚀刻工具和晶片键合机。
And all of the foundries utilize similar equipment, which includes deep reactive ion etch tools and wafer bonders.
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