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原创：OLED柔性衬底封装材料研究进展 - 科技论文发表 - xzbu.com 中国论文网 关键词：封装材料；有机电致发光器件；柔性显示 [gap=708]Keywords:packaging materials; OLED; flexible display
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...键词：LED，封装材料，有机硅，环氧树脂，乙烯基硅树脂，加成型液体硅橡胶 [gap=8857]Keywords：LED，encapsulation material，silicone，epoxy resin，vinyl silicone resin，addition type ...
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封装用有机硅材料的制备及性能研究 关键词】有机硅树脂；封装材料；LED；固化 [gap=841]Keywords：silicone；encapsulant；LED；curing
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电子封装材料 electronic packaging material ; electronic encapsulation materials ; electronics package material
环氧高分子封装材料 Epoxy Molding Compound
半导体封装材料 Semiconductor packaging material
液态封装材料 Liquid Encapsulate
晶丰电子封装材料 EP Materials
封装材料及工艺 Packaging materials and processing
微电子封装材料数据库 microelectronics packaging materials database
环氧模塑封装材料 Epoxy Molding Compound
硅铝电子封装材料 si-al composites for electronic packaging
First the research background, significance and status of the project,as well as permeability measurement of packaging material for OLED in domestic and foreign was introduced.
介绍了课题的背景、意义和研究现状,以及目前国内外OLED器件封装材料渗透率测量的有关研究。
参考来源 - OLED封装材料气体渗透率的测量Anisotropic conductive adhesive (ACA) is an advanced packaging material with lots of merits, but its manufacture is of high tech upon multiple branches of knowledge.
各向异性导电胶是一种具有很高价值的新型的封装材料,但它的制造涉足到多个学科分支。
参考来源 - 各向异性导电胶中柔性颗粒化学镀镍研究Nowadays, the micromation is mainly one of the development aspects of printed circuit board (PCB) and the package of electronic components. The polymer-based electronic package material has been proved to be promising for use in the package of electronic components.
微型化已经成为印刷线路板和电子封装材料发展的主要方向之一，聚合物基电子封装材料在电子器件封装应用中具有广阔前景。
参考来源 - 高导热低介电氮化铝/聚酰亚胺纳米复合薄膜的制备和性能研究9 , 10 - dihydro-9-oxa-10-phosphaphenanthren-10-oxide(DOPO) is a novel reactively flame-retardant intermediate. Flame-retardants which are synthesized by DOPO have excellent thermal-stabilities and flame-retardancy, can be used to the flame retardancy of electronical facilities, synthetic fiber and semi-conductor encapsulation material.
9,10一二氢-9-氧杂-10-磷杂菲一10-氧化物(DOPO)是新型反应型阻燃剂中间体,由它合成的阻燃剂有优良的热稳定性和阻燃性,可用于电子、合成纤维、半导体封装材料的阻燃。
参考来源 - 含磷阻燃剂DOPO的合成及在环氧树脂中的应用·2,447,543篇论文数据，部分数据来源于NoteExpress
研究证明水蒸汽能迅速渗入塑料封装材料。
Studies show that water vapor quickly permeates plastic packaging material.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
The material is hopefully used as novel printed circuit board and package material of electronic components.
热应力主要是在制造过程中由于环境温度变化和封装材料热失配而产生的。
The stresses are formed in the manufacturing process because of the change of temperatures and the thermal mismatch between different materials.
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