故研发一种新型封装材料势在必行。
It is imperative to develop a new kind encapsulation material.
并展望了电子封装材料的发展前景。
The prospects for the further development of electronic packaging materials were given.
该封装材料用于填充该凸部的内部。
Packaging material is in use for filling up inside the convex part.
本发明还提供一种封装材料的制造方法。
The invention also provides a method for fabricating an encapsulant material.
研究证明水蒸汽能迅速渗入塑料封装材料。
Studies show that water vapor quickly permeates plastic packaging material.
微电子行业迫切需要新一代优异性能的封装材料。
It is an urgent demand of new generation packaging materials with excellent properties in the microelectronic industry.
电子封装材料；
对传统金属电子封装材料的研究开发现状进行了简单评述。
A brief review of the research and development of the traditional packaging materials is given.
研究测试了40多种光纤光栅封装材料的配方及封装工艺。
More than 40 kinds of overlay coating stuff and their technics were studied and tested for many times.
本文研究了一种用于去除封装材料的数控精密激光切割技术。
The paper puts forward a kin of numerical controlled laser cutting technique applied to wipe off encapsulation of chip.
这样的材料在电子封装材料和印刷线路板中具有很大的应用前景。
The material is hopefully used as novel printed circuit board and package material of electronic components.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
A new production method of green electrical packaging material, which can resist fire and crack epoxy resin sealing compounds was introduced.
热应力主要是在制造过程中由于环境温度变化和封装材料热失配而产生的。
The stresses are formed in the manufacturing process because of the change of temperatures and the thermal mismatch between different materials.
本发明涉及聚苯基甲基乙氧基硅烷改性环氧树脂及其电子封装材料的制法。
The invention relates to polyphenyl methylsiloxane modified epoxy resin and a manufacturing method of an electronic packaging material thereof.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
本发明公开了一种增强光反射的封装材料、硅晶太阳光电模块及薄膜太阳光电模块。
The invention discloses a packaging material for strengthening light reflection, a silicon solar photoelectric module and a film solar photoelectric module.
本研究综述了MEMS的封装材料，包括陶瓷、塑料、金属材料和金属基复合材料等。
Account of package materials of MEMS, including ceramics, plastic, metal material and metal compound material, etc was given.
实验和理论结果表明，管壳的几何形状比封装材料对传感器瞬态响应时间的影响更重要。
Results show that the geometry of the case has more profound effect on the sensor response time than that of the packaging material.
对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
本发明的封装材料组成物具有高折射率，可应用于高效能固态发光组件，提高出光效 率。
The encapsulation material composition has high refractive index, can be applied to a high-efficient sold luminous element and improves light emergence efficiency.
本文介绍了抗高过载电路的封装技术与封装材料，对抗高过载电路的封装工艺作了详尽的探讨。
The paper introduces the packaging technology and materials for the anti-high load circuit. It explores the packaging craftsmanship in details.
全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。
Global semiconductor packaging materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets.
由于目前的房屋设计中，阳台上没有预留封装材料的“落脚点”，因此给阳台封装造成一定难度。
Because in the present house design, in the balcony has not reserved the seal material "to fall the foot spot", therefore creates the certain difficulty for the balcony seal.
但是3dmic需要高性能的封装材料(特别是对于微波损耗来说)，高容量、低成本的生产能力。
But 3dmic need the packaging material which has the higher performance (especially to microwave loss) and the production capacity which has the higher volume and lower cost.
而要研制高阻隔性封装材料，首先要解决如何测量水蒸气、氧气和其他活性气体对封装材料的渗透率的问题。
How to accurately measure permeation rates of water vapor and oxygen through packaging materials is very important for developing high quality barrier packaging materials.
近年来，我国太阳能电池的生产量以非常惊人的数量增长，使相关封装材料和技术的研究与开发显得越来越重要。
In recent years, the output of the solar cells in China grows in a soaring speed, which makes the related encapsulation materials and technology research and development more important.
因此，对PPS微粉制备、PPS纯化研究等提高PPS树脂档次的研究以及将PPS树脂用于封装材料研究具有重大的意义。
Therefore, it is valuable to develop process for preparing PPS fine powder, high purity PPS and PPS based electronic encapsulation materials. This thesis consists of the following three parts.
由于环氧树脂固化物所具备的优良性能，使得环氧树脂被广泛地应用于各行各业。特别是电子、电气封装材料、复合材料等领域。
Because of the outstanding advantages, the epoxy resin is widely used in various fields, especially in the fields such as electronics, covering materials and synthetic materials etc.
由于环氧树脂固化物所具备的优良性能，使得环氧树脂被广泛地应用于各行各业。特别是电子、电气封装材料、复合材料等领域。
Because of the outstanding advantages, the epoxy resin is widely used in various fields, especially in the fields such as electronics, covering materials and synthetic materials etc.
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