半导体封装材料( Semiconductor packaging material) 3. 半导体封装量测( Semiconductor packaging measurement) 四、系统设计组： 1.
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全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。
Global semiconductor packaging materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets.
成功实施的E4类更环保的半导体封装友好材料。
'The E4 successfully implemented more environmentally friendly materials for semiconductor packages.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
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