【through-silicon_via】什么意思_英语through-silicon_via的翻译_音标_读音_用法_例句_在线翻译

through silicon via

硅通孔技术

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穿孔技术

Welcome MS供应商意法半导体（STMicroelectronics，简称ST；纽约证券交易所代码：STM）率先将矽穿孔技术（Through-Silicon Via，TSV）导入MEMS晶片量产。在意法半导体的多晶片MEMS产品（如智慧型感测器和多轴惯性模组）内，矽穿孔技术

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技术

Welcome MS供应商意法半导体（STMicroelectronics，简称ST；纽约证券交易所代码：STM）率先将矽穿孔技术（Through-Silicon Via，TSV）导入MEMS晶片量产。在意法半导体的多晶片MEMS产品（如智慧型感测器和多轴惯性模组）内，矽穿孔技术

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硅基板穿孔

... 硅基板穿孔 Through-Silicon Via 硅钙板 calcium silicate board with microporous 用硅基板穿孔 Through-Si Via ...

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硅穿孔技术

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短语

Through Silicon Via 硅通孔技术 ; 硅穿孔

through-silicon via packaging 硅片直通孔封装技术

Through Silicon Via-TSV 晶圆通路

silicon-through-via 在硅通孔技术 ; 硅通孔技术

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电子、通信与自动控制技术

tsv技术

·2,447,543篇论文数据，部分数据来源于NoteExpress

Through-silicon via

abstract: In electronic engineering, a through-silicon via (TSV) is a vertical electrical connection (via)(Vertical Interconnect Access) passing completely through a silicon wafer or die. TSVs are a high performance technique used to create 3D packages and 3D integrated circuits, compared to alternatives such as package-on-package, because the density of the vias is substantially higher, and because the length of the connections is shorter.

以上来源于: WordNet

双语例句

This article will review today's challenges, along with such future trends as integration and through-silicon via(TSV) technologies.

概述当今的挑战，以及这些集成和硅通孔技术的未来趋势。

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The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。

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A via hole is formed in the substrate within the spirally patterned conductor layer, the via hole being formed by through silicon via (TSV).

介层洞形成于螺旋图案化导体层内部的基材中，该介层洞通过硅通孔技术制成。

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