每粒晶片键合电极面朝上装在粘性膜上。
Each pellet is mounted on an adhesive sheet with wire-bonded electrode side up.
穿孔金属晶片载体也用于晶片键合，用以容易地处理以及松解。
A perforated metal wafer carrier is also used for wafer bonding for easy handling and de-bonding.
所有芯片制造厂都使用类似的设备，包括深反应离子蚀刻工具和晶片键合机。
And all of the foundries utilize similar equipment, which includes deep reactive ion etch tools and wafer bonders.
介绍了微电子机械系统的四种基本制作技术，即本体微机械加工、表面微机械加工、铸模工艺和晶片键合工艺。
Four fundamental manufacturing technologies namely bulk micromachining, surface micromachining, moulding and wefar bonding are introduced for Micro Electro Mechanical System(MEMS).
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
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