[阅读全文] 分类: 互帮合作 标签: 南京理工大学 晶片直接键合(Wafer Direct Bonding,WDB) Posted by Coofish 2010年12月10日 晶片直接键合(Wafer Dire...
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[阅读全文] 分类: 互帮合作 标签: 南京理工大学 晶片直接键合(Wafer Direct Bonding,WDB) Posted by Coofish 2010年12月10日 晶片直接键合(Wafer Dire...
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The basic design of 1310nm VCSELs, key technologies developed in this thesis such as material growth of tunnel junction, wafer direct-bonding and fabrication of current aperture etc are the groundworks of future VCSEL devices for performances optimizing.
本文给出的1310nm VCSEL器件设计方法、隧道结生长、晶片直接键合和电流孔径制作等关键工艺的突破为今后VCSEL器件性能优化打下了良好的基础。
参考来源 - 1310nm垂直腔面发射激光器设计与研制·2,447,543篇论文数据,部分数据来源于NoteExpress
晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
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