vapor phase solder reflow 汽相焊料回流
Solder Reflow 回流焊接 ; 锡膏回流
Solder Reflow Profile 回流焊接的温度曲线
Recommended Solder Reflow Profile 推荐的回流焊接的温度曲线
No solder ball after reflow 回流过程中不出现焊锡珠
Reflow Solder 回流焊接工艺 ; 回流过程
Vacuum reflow solder 真空再流焊接
The solder-reflow machines is the key equipment of this technology . In this paper, the electrical control system for SMT solder-reflow machines is designed, based on the SMT solder temperature curve.
回流焊是这种技术的关键设备。
参考来源 - SMT回流焊设备电控系统的设计开发·2,447,543篇论文数据，部分数据来源于NoteExpress
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
Compatible with infrared and vapor phase reflow solder process.
红外线和汽相回流焊工艺兼容。
应用推荐