Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
Compatible with infrared and vapor phase reflow solder process.
红外线和汽相回流焊工艺兼容。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
This study benchmarked the strength of solder joints formed through the Through - Hole Reflow process against the traditional wave soldered joint.
以波峰焊工艺焊点强度为标准，研究在不同钎料量下通孔再流焊焊点的强度。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
The three different solder pads may each require a slightly different temperature for a simultaneous reflow.
三种不同的焊盘可能需要为同时回流温度略有不同。
Suit for reflow and wave flow solder.
适应再流焊与波峰焊。
Suit for reflow and wave flow solder.
适应再流焊与波峰焊。
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