Vacuum reflow solder 真空再流焊接
vapor phase solder reflow 汽相焊料回流
Solder Reflow 回流焊接 ; 锡膏回流
No solder ball after reflow 回流过程中不出现焊锡珠
solder-reflow [机] 回流焊
Solder Reflow Profile 回流焊接的温度曲线
Recommended Solder Reflow Profile 推荐的回流焊接的温度曲线
Compatible with infrared and vapor phase reflow solder process.
红外线和汽相回流焊工艺兼容。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
应用推荐