vapor phase solder reflow 汽相焊料回流
solder-reflow [机] 回流焊
Solder Reflow Profile 回流焊接的温度曲线
Recommended Solder Reflow Profile 推荐的回流焊接的温度曲线
No solder ball after reflow 回流过程中不出现焊锡珠
Reflow Solder 回流焊接工艺 ; 回流过程
Vacuum reflow solder 真空再流焊接
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
However, the position of the solder joints formed (underneath the chip) after reflow means that visual inspection is impossible.
回流后在芯片下方形成焊点的位置表明，目检是不可能的。
应用推荐