镀铜是在电镀工业中使用最广泛的一种预镀层，包括锡焊件、铅锡合金、锌压铸件在镀镍、金、银之前都要镀铜，用于改善镀层结合力。
添加剂对脉冲酸性镀铜通孔均匀沉积的影响 关键词：脉冲电镀；通孔；印刷电路板；添加剂；电镀铜 [gap=1036]Keywords：pulse electroplating；through—hole；printed circuit board；additive；copper plating
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石墨纤维表面电镀铜工艺研究 关键词：石墨纤维；氧化处理；电镀铜 [gap=962]Keywords：graphite fiber；oxidation treatment；copper electroplating
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... electro copper foil电镀铜箔 copper (electro)plating; electrocoppering电镀铜 copper-beryllium镀 铜合金分析仪 ...
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沉积铜(CVD Cu),无电镀铜(Electroless Cu),电镀铜(Electro-plating Cu),电 迁移特性,阻碍层金属,应力衰退机制,纵横比效应,平坦化,铝填充
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电镀铜箔 electro copper foil
电镀铜法 electrocoppering
电镀铜皮 ED Foil ; galvanic shell
无电镀铜 Electroless Copper
表面电镀铜色 Surface of the copper plating ; Electroplating copper ; copper plating surface
电镀铜锡合金 copper-tin alloys plating
无电镀铜液 electroless copper plating liquid
电镀铜锌合金 copper-zinc alloys plating
玻璃电镀铜 copper electroplating on glass surface
Two main kinds of routes of replacing copper plating with cyanides, electrocoppering in acid solution and Pollution-Free electroless copper plating were explained in this thesis. The characteristics and limits in applying of electrocoppering in acid solution were introduced simply.
本文阐述了取代氰化镀铜的两种主要途径,即酸性电镀铜和无公害化学镀铜,简单地介绍了酸性电镀铜的特点以及应用的局限性,综述了无公害化学镀铜的定义、特点、分类以及与本文有关的两种无公害化学镀铜—置换镀铜和还原镀铜的研究进展。
参考来源 - 钢铁基体无公害化学镀铜配方及工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
电镀站是否有酸解电镀铜系统？
Is the copper plating process an electrolytic acid copper plating system?
规格：电镀铜制品并镶有精密陶瓷片。
适用于：酸性电镀铜、线路板、电铸模、制版电镀等。
Apply to: apply to: acid electroplated copper electric circuit board electroforming mould and electroplating for printing plate making etc.
应用推荐