电镀站是否有酸解电镀铜系统？
Is the copper plating process an electrolytic acid copper plating system?
电镀铜制品并镶有平面不锈钢片。
The nickel-coating brass body & grinding stainless steel wafer.
电镀铜制品并使用平面不锈钢帽。
The nickel-coating brass body & grinding stainless steel cap.
规格：电镀铜制品并镶有精密陶瓷片。
该方法进一步包括在该种晶层上电镀铜空隙填充。
The method further includes electroplating copper gapfill onto the seed layer.
适用于：酸性电镀铜、线路板、电铸模、制版电镀等。
Apply to: apply to: acid electroplated copper electric circuit board electroforming mould and electroplating for printing plate making etc.
对电铸铜与电镀铜工艺、电铸镍与电镀镍工艺进行了比较。
Copper electroforming and nickel electroforming processes were compared with copper electroplating and nickel electroforming process respectively.
电镀铁壳，电镀铁圈，玻璃面，铜机芯，铜管子。电镀铜接头。
Chrome plating steel case and ring, glass lens, brass internal and connection, Chrome plating brass joint.
介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件。
The research progresses and applications of Cu-Sn alloy plating process are presented, and the bath formulations and operational conditions of Cu-Sn alloy plating process are also introduced.
通过对比电镀铜工艺中不同的转速对孔洞缺陷的影响，得到电镀时转速与孔洞缺陷的关系；
The resistance and stress of Cu film will be studied by different rotation speeds, anneal process and queue time (ECP to CMP).
第一层包覆所述金属芯的外表面，并且通过从包含铜离子的第一浴中电镀铜或铜合金产生。
The first layer encases the eternal surfaces of the metallic core and is produced by electroplating copper or copper alloy from a first bath containing copper ions.
电镀铜锡合金是一种合适的代镍镀层，它不使人体过敏，能满足防扩散性能的要求，且成本较低。
Cu Sn plating is a right substitute for nickel coating because it is not allergic to human body, can meet anti diffusion requirement and has a lower cost.
因此，用钯导电体层形成溶液将工件转变成导体，所述溶液是中性的，不使用高碱性无电镀铜溶液。
Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline.
电镀铜是PCB加工过程中的一个关键工艺流程，涉及到孔和板面金属化的性能保证，影响因素众多。
The plating copper is a key process in the production of PCB, which involves the quality assurance of metallization of PTH holes and laminate surface, and is affected by a number of factors.
电镀铜层具有良好的导电、导热、延展性等优点，因此，电镀铜技术被广泛应用于电子材料制造领域。
Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.
主要探讨了影响电镀铜用磷铜阳极质量的因素，包括原材料、铜晶粒结构、磷含量及阳极表面的清洁。
The plating conditions show great influences on the P content of the coatings and thus the corrosion resistance.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
一张棕色的格子纹沙发，一张蓝绿色的躺椅，一个木制的摇椅，还有一个电镀铜色的架子，上面挂满了真皮腰带和钱包。
A brown, plaid sofa and a teal recliner, a wooden rocker and brass coat rack draped with leather belts and purses.
研究了碱性电镀铜溶液中加入的两种配位剂—— 乙二胺和柠檬酸钠的加入量，并对两种配位剂的作用作了初步的探索。
In this paper, a primary investigation was made on the addition amounts and effects of two ligands, ethane diamine and sodium citrate, in basic copper galvanization solution.
在引入电镀铜工艺的同时我们也不得不面对一些铜线工艺所特有的缺陷，如铜线和低K值介电质可靠性问题，以及电镀铜后产生的孔洞缺陷等问题。
We have to face some Cu line issues after we use Cu to replace AL, such as the reliability with Cu and low K dielectric, and post-CMP (Chemical Mechanical Polishing) Cu line voids defect.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
镀铜：打底用，增进电镀层附着能力，及抗蚀能力。
Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.
尤其在中、高端散热器电镀方面，在酸性镀铜、镀镍、黑镍等有着丰富的生产实践经验，在电镀行业领域具有领先地位。
Especially in, high-end radiator electroplating, in acid, nickel plated copper plating nickel etc, black has a wealth of experience in production practice, plating industry area is the lead.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
锡焊件、铅锡合金、锌压铸件、铍青铜、磷铜等合金在电镀前也常用预镀铜来改善结合力。
Tin welding parts and lead-tin alloy die casting, zinc, beryllium bronze, phosphorus copper alloy in electroplating copper with commonly used before also gets to improve adhesion.
尤其在中、高端散热器电镀方面，在酸性镀铜、镀镍、黑镍等有着丰富的生产实践经验，在电镀行业领域具有领先地位。
Especially in, high-end radiator electroplating, in acidic copper, nickel, black nickel, and so has the rich production experience, in electroplating industry area is the leading status.
光亮酸性镀铜在现代电镀中占有重要的地位，其关键在于光亮刑的选择和应用。
Bright acid copper facing occupies the important position in electroplating modernly, its key lies in choice and application of the bright pharmaceutical.
硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。
The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
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