基于FEA的Cu pad模型对焊点可靠性的影响分析_电子行业学术文章_质量学术文章_电子质量E周刊 关键词： Cu pad；焊点可靠性；有限元；BGA [gap=616]Key words: Cu pad;Solder Joint Reliability;finite element;BGA
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无铅焊点可靠性 Reliability of lead-free solder joints
The results show that the lesser elasticity module and Coefficient of Thermal Expansion can availably reduce thermal stress, affect the package warpage and the solder joint reliability are the substrate thickness and the die thickness.
计算结果表明，采用较小的弹性模量和热膨胀率的材料可以有效地减小热应力；基板和芯片的厚度是影响封装体热变形和焊点可靠性的主要因素。
参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计Finally,the reliability of CSP solder joints was tested. The results show that using thin chips can improve the reliability of solder joints.
结果表明,用薄芯片可提高焊点可靠性。
参考来源 - 芯片尺寸封装焊点的可靠性分析与测试Finally, Solidification cracks in SnAgCu lead free solder joints were investigated because it influences on the solder joint reliability.
最后,探讨了影响焊点可靠性的结晶裂纹问题。
参考来源 - 微量元素对SnAgCu无铅钎料性能和显微组织的影响The reliability of the solder joint decides the quality and development of electronic production. In fact, heat is the main reason for the failure of electronic package.
实践证明,热作用是封装组件失效破坏的主导因素,因此对热循环条件下的焊点可靠性进行研究有着非常重要的意义。
参考来源 - 多芯片组件（MCM）焊点可靠性的有限元模拟与寿命的预测·2,447,543篇论文数据，部分数据来源于NoteExpress
研究现状表明快速冷却有助于减少焊接缺陷，提高焊点可靠性。
It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
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