研究现状表明快速冷却有助于减少焊接缺陷，提高焊点可靠性。
It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
对混合焊点的失效形式和混合焊点的失效机理进行了分析，并进一步介绍了影响这类焊点可靠性的因素。
Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。
In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.
着重研究了机械冲击和应力对无铅BGA封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。
The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.
为提高可靠性，降低的热膨胀系数(热膨胀系数)的不匹配与PC B减少了从热循环所得的焊点的裂缝的可能性。
For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.
因此，有必要对这种混合焊点进行可靠性分析。
Therefore, it is necessary to study the reliability of this mixed solder joint.
讨论了弯曲跨距、焊盘尺寸等参数、以及焊点所经历的回流、老化等热过程对PC B焊点弯曲可靠性的影响。
The effects of bending support span, solder pad size, reflow and aging history on PCB bending reliability are discussed.
分析焊点的可靠性，制定了焊点失效判定准则；
The reliability of solder joints is analyzed, and a failure criteria is given out as well.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
因此，焊点跌落可靠性是无铅便携式电子产品可靠性的关键内容。
So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.
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