笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；

Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.

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在无铅化进程中，由于无铅焊点焊料的不同和焊接工艺参数的调整，必然会给焊点可靠性带来许多新的影响。

In the process of lead-free, because of the difference of lead-free solders and adjustment of technical parameter, we will face many new problems of reliability.

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着重研究了机械冲击和应力对无铅BGA 封装焊点可靠性的影响，介绍了BGA 封装的可靠性力学试验（跌落、弯曲试验）及其分析方法。

The methodologies for free drop test and bending test are introduced, considering the important effect of mechanical stress on the reliability of lead-free BGA packaging.

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