Micro-Through Via 或微导通孔
Through Via Hole 全通导孔 ; 导通孔
silicon-through-via 在硅通孔技术 ; 硅通孔技术
through-via 贯穿过孔
through via filling 贯通导通孔填充
Downloadable Through Via Email 下载通过电子邮件
Through-Silicon Via 穿孔技术 ; 技术 ; 硅基板穿孔 ; 硅穿孔技术
through-hole via 经由通孔 ; 通孔
Through-Si Via 再利用硅基板穿孔 ; 穿孔 ; 用硅基板穿孔 ; 硅通透孔
Through via technology should satisfy control requirement of outline,including tilt,shape,roughness,over-cut,and so on. The reliability,usability and duplication should be satisfied.
通孔技术需要能满足对轮廓形状的控制(包括控制倾斜度、形状、粗糙度、过刻蚀等),同时又要求工艺能具有可靠性、实用性和重复性,最后,成本也要能被合理控制。
参考来源 - 反应离子刻蚀在穿透硅通孔封装技术中的应用研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Growth was also robust 5 in 2016 in online to offline services such as ride hailing and food delivery apps that customers pay for through via platforms.
去年，线上到线下服务也增长强劲，如叫车和送餐应用，在这类服务中，消费者通过平台支付。
Through via technology should satisfy control requirement of outline, including tilt, shape, roughness, over-cut, and so on. The reliability, usability and duplication should be satisfied.
通孔技术需要能满足对轮廓形状的控制(包括控制倾斜度、形状、粗糙度、过刻蚀等)，同时又要求工艺能具有可靠性、实用性和重复性，最后，成本也要能被合理控制。
Boats travel under this wall via a tunnel, then through the locks, and finally on to the Union Canal.
船只在这堵墙下通过一条隧道，然后穿过水闸，最后到达联合运河。
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