• 焊膏 - 引用次数：9

  A kind of solder paste material was successfully developed.

  研制出了新的无铅焊膏材料。

  参考来源 - 新型活化剂的合成及在无铅焊膏产品上的应用
  膏状钎料 - 引用次数：5

  Based on these tests, it proved that copper solder paste had a good wettability, and mechanical properties of brazed joints could reach the request.

  证明了紫铜膏状钎料具有良好的润湿性,其钎焊接头机械性能均达要求。

  参考来源 - 组合式异型管钢制室内散热器铜填料硬钎焊新工艺方法研究
• 焊膏 - 引用次数：14

  Mini-stencil is the traditional method used in the electronics manufacturing industry for the deposition of solder paste onto reworked component sites.

  最小型模板用于把焊膏淀积到返修的元件部位的电子制造业的传统方法。

  参考来源 - 芯片级尺寸封装返修技术工艺评定
• 焊钖膏
  焊膏
• 锡膏

·2,447,543篇论文数据，部分数据来源于NoteExpress