These examples illustrate that to perform an effective solder paste inspection, the inspection system must be able to provide not only area but also accurate volume and height information.
这些例子说明，要进行有效的焊膏检测，检测系统必须不仅能提供印刷焊膏的面积信息，还应能提供其精确的体积和高度信息。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
This product is no-clean solder paste, very little residue, no cleaning.
本产品是免清洗焊膏，几乎无残留，无需清洗。
Use only with production equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
A solder paste used for brazing was developed and its technical performance was investigated.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。
In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.
表面贴装，钢网是锡膏准确重复印刷的关键。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
The present invention relates to a solder paste composition used for precoating an electrode surface with solder.
本发明提供一种钎焊膏组合物，该组合物可应用于电极表面预涂钎料。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
For solder paste with more small particles introduced, shear-thickening appears before the onset of shear thinning.
当小尺寸焊料添加达到一定量时，在剪切变稀开始前出现剪切增稠现象。
Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder.
焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
The use of solder paste was simulated by solder paste mixer and the variation on appearance of solder paste was observed.
采用锡膏搅拌机模拟锡膏使用过程，观察锡膏状态随搅拌时间的变化。
Of greater value to the stencil designer is the area ratio, which can be related directly to eventual solder paste release.
对于钢网设计者来说非常重要的是面积比率。它直接与锡膏释放有关。
Effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were investigated.
研究了焊粉粒度分布和氧含量对锡膏稳定性的影响。
The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.
文章从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005元件装配工艺技术。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology (SMT) product line.
建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
The invention relates to a nonresinous solder paste made of a metal powder, especially soft solder, and a gel which leaves no residues on the metal surface when the metal powder is melted down.
根据本发明，不含树脂的焊膏由一种金属粉末，特别是软焊料和一种凝胶体制成，其中，根据本发明的凝胶体在重熔金属粉末的过 程中，不在金属表面上留下残留物。
This article focuses on the solder paste material what happens at the various stages of reflow, the profiles they generate and their effects on the various constituent materials of the solder paste.
该文集中在讨论焊膏在回流焊不同阶段中会发生些什么，产生的温度分布及其对焊接组成材料的影响等。
Squeegee Bodyguard can thoroughly clean your squeegees and return a clean and tidy printing environment to you. Occurrences of solder paste pollution and steel mesh blocking will be greatly lowered.
刮刀卫士，彻底清洗你的刮刀，还你一个清洁、干净的印刷环境，锡膏污染、钢网堵塞问题大大降低了。
Is the expiry date of the Solder Paste controlled?
是否对焊膏的有效期进行控制？
Is the expiry date of the Solder Paste controlled?
是否对焊膏的有效期进行控制？
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