This paper presented a new method for multi chip module routing.
对多芯片组件的布线方法提出了一种新的方法。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
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