...;低温键合 [gap=16205]Key words:silicon photonics;optical interconnect;heterogeneous integration;low temperature bonding ...
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Low temperature bonding strength 低温粘结强度
low temperature metallic bonding 低温金属键合
low temperature wafer bonding 低温晶片键合
low temperature direct bonding 低温直接键合
low temperature sintering bonding 低温烧结连接
low temperature ultrasonic bonding 低温超声互连
low temperature wafer direct bonding 圆片低温键合
low temperature silicon direct bonding 低温硅片直接键合技术
The article presents advantages of the dry heat technology, adhesives available, benefits of low temperature bonding and important parts in a laminating machine.
本文介绍了干热层合技术的优点，可供使用的粘合剂、低温粘合的优点及层合机的组成。
Conclusion: Low temperature plasma treatment might be used to improve the surface wettability and bonding strength of denture base acrylic resin.
结论：低温等离子体处理树脂材料表面可提高其润湿性及粘接性。
Bonding products and strong, fast drying, storage of non-hierarchical, not precipitation, low-temperature performance and resistance.
产品粘接力强、干燥速度快、存放不分层、不沉淀、耐低温性能好。
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