through-hole plating 穿孔电镀
fill-hole plating 填孔镀铜
Hole Wall Copper-Plating Thickness 孔壁镀铜层厚度
plating through hole 镀通孔 ; 通孔
Plating hole 孔分为导通孔
Plating-through-hole Board 孔化印制板
Non-plating Through Hole Board 非孔化印制板
BIG HOLE MULTI-COLOR PLATING WEIGHT 多彩电镀大孔杠铃片
None Plating hole 与不导通孔
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
Loose hole plating chromic layer by weight used in the sliding friction parts and heat resistance, corrosion, wear parts, such as internal combustion engine cylinder lumen, piston rings.
松孔镀铬层应用于受重压的滑动摩擦件及耐热、抗蚀、耐磨零件，如内燃机汽缸内腔、活塞环等。
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