...核心层之中，以加有玻璃纤维的树脂板为中心，再让绝缘层和铜镀金电路交织而成，此类构造需要使用电镀通孔(Plating Through Hole)，导致核心层的设计自由度降低。
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A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
已经到达上端的电镀液穿过管状电极的通孔循环。
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