This paper introduced a copper plating process for micro-via filling and through hole plating simultaneously in DC application.
介绍了一种利用直流电源进行微盲孔和通孔同时电镀的工艺，同时给出了相关的工艺条件和电镀效果。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
Loose hole plating chromic layer by weight used in the sliding friction parts and heat resistance, corrosion, wear parts, such as internal combustion engine cylinder lumen, piston rings.
松孔镀铬层应用于受重压的滑动摩擦件及耐热、抗蚀、耐磨零件，如内燃机汽缸内腔、活塞环等。
Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.
镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
The experimental results show that CH plating hole targets have higher laser energy injection efficiency.
实验结果表明：镀CH膜是增加激光能量注入率、提高腔靶辐射温度的有效方法。
It is proved in practice that correct selection of the additives in deep hole nickel plating can effectively increase the ability of deep hole nickel plating with full bright coating.
实践证明正确选择全光亮深孔镀镍添加剂，可以有效地提高深孔镀镍能力。
This paper introduce the American New Dimension Plating has used hole purify implement to reclaim chrome acid and improved the former disposal system.
本文简介美国新维电镀公司使用多孔净化器回收铬酸，并对原处理系统进行了改进。
We use the AAO as template, well-aligned and highly ordered nano-hole array copper membranes were copied from the template by vacuum plating.
我们利用AAO膜为模板，采用物理的方法制备得到了金属铜的纳米孔洞阵列膜。
The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying.
本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序。
The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.
已经到达上端的电镀液穿过管状电极的通孔循环。
The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying and tin plating treatment.
本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序、镀锡处理工序。
The invention comprises the following procedures: preplating, etching, chromium plating, washing, removal of hydrogen, hole loosing, washing and drying and tin plating treatment.
本发明包括镀前工序、刻蚀工序、镀铬工序、水洗工序、除氢工序、松孔工序、水洗烘干工序、镀锡处理工序。
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