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The third bonding wire is electrically connected between the second chip and the loader.
第三焊线电性连接于第二芯片与承载器之间。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The second bonding wire is electrically connected between the relay circuit base board and the loader.
第二焊线电性连接于中继线路基板与承载器之间。
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