bonding wire [机] 焊线 ; [电] 接合线 ; 结合线
copper bonding wire cu键合丝 ; 如半导体器件键合铜丝 ; 键合铜线
self-bonding wire 涂层的自粘漆包线
WIRE BONDING 打线结合 ; 线接合
aluminium-silicon bonding wire 键合硅铝丝
missing bonding wire 漏邦铝线
ultrasonic wire bonding 超音波引线压接 ; 超声引线键合
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Wire bonding is a critical technique for realizing microwave hybrid circuit.
引线键合是实现微波混合电路的关键技术。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
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