The third bonding wire is electrically connected between the second chip and the loader.
第三焊线电性连接于第二芯片与承载器之间。
The RF characteristics of bonding wire interconnection in a simple package model were simulated.
针对一种用键合线连接的简单封装模型进行射频性能的模拟。
The second bonding wire is electrically connected between the relay circuit base board and the loader.
第二焊线电性连接于中继线路基板与承载器之间。
The second bonding wire is electrically connected between the relay circuit base board and the loader.
第二焊线电性连接于中继线路基板与承载器之间。
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