Wafer bonding technology is a process that two clean and flat wafers are jointed with chemical bonds on wafer surfaces in a required condition.
两个表面平整洁净的硅片在一定条件下可以通过表面的化学键互相连接起来,这就是硅硅直接键合技术。
参考来源 - 硅硅直接键合的理论及工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The applications of cryogenic adhesive bonding technology in SQUID non - magnetic Dewar and other fields are introduced.
介绍了低温粘接技术在SQUID 无磁杜瓦及其它领域中的应用。
Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.
微胶接技术非常适用于微机电系统产品的自动化装配过程。
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