Components qualities of bonding technology are influenced by many factors, which are complicated.
接工艺中构件质量受多种因素的影响，内容比较复杂。
The silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.
硅片键合往往与表面硅加工和体硅加工相结合，用在MEMS的加工工艺中。
The applications of cryogenic adhesive bonding technology in SQUID non - magnetic Dewar and other fields are introduced.
介绍了低温粘接技术在SQUID 无磁杜瓦及其它领域中的应用。
Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.
微胶接技术非常适用于微机电系统产品的自动化装配过程。
Bonding technology has been widely applied to the manufacture of bus and become an important part of the manufacture of bus.
粘接技术已经广泛应用于大客车的生产，并成为客车生产的重要组成环节。
Some applications of medical adhesives and their bonding technology in the medicine domain were briefly introduced in this article.
简要介绍了医用胶粘剂及其粘接技术在医学领域中的一些应用。
Through lots of researches, divided airtight coat and its bonding technology is adopted, and the model of the coat is produced by rapid modeling technology.
通过查阅大量的资料和实验研究，研究出分体式的密封外衣的粘结技术。
This paper investigates one kind of micro heat pipe arrays (MHPA), which are fabricated by advanced silicon bulk micromachining and anodic bonding technology.
介绍了一种基于硅体加工技术以及阳极键合技术的微热管阵列。
In the design of the semiconductor laser groupware, selection of lasers, design of an optical system and a laser circuit and the bonding technology are key factors.
在半导体激光器模组设计中，激光器选择、光学系统设计、激光器电路设计与“邦定”技术是模组设计的关键部分。
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料，包括金丝、铜丝和铝丝。
Ceramic - metal composite components have a wide application prospect, and the bonding technology of ceramics to metals is a key to the practical application of ceramics to engineering.
陶瓷与金属组成的复合构件具有广阔的应用前景，而陶瓷与金属的连接技术是陶瓷工程应用的关键。
This paper focuses on the research of bonding technology of Chinese Larch Glulam (glued-laminated timber) with Phenol resorcinol formaldehyde(PRF) and Aqueous polymer Isocyanate(API)adhesives.
本论文对常温固化型胶粘剂间苯二酚PRF和高分子异氰酸酯API落叶松集成材的胶合工艺技术进行了研究。
Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products. The producing technology and major diagrams were given in detail.
从应用开发MEMS产品的实用角度出发，介绍了利用硅一硅键合技术制作的微型电容式压力传感器，给出了详细的制作工艺及主要工艺步骤图。
The text introduced the test method and application in some special instances about Information technology equipment Protective Bonding Conductor in Type test and Routing test.
介绍了型式认可试验和工厂例行检验中有关信息技术设备的保护连接导体电阻的测量方法，以及在某些特殊设备上的应用。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
So bonding performance of the interface and internal force translating mechanism between FRP and high strength concrete are crucial in FRP strengthening technology.
FRP与混凝土之间通过界面层传递内力，研究界面层的粘结性能和内力传递机理是FRP加固技术的关键。
The article presents advantages of the dry heat technology, adhesives available, benefits of low temperature bonding and important parts in a laminating machine.
本文介绍了干热层合技术的优点，可供使用的粘合剂、低温粘合的优点及层合机的组成。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
The bonding of zircaloy and stainless steel is an important technology in project of nuclear reactor and it has not been solved completely as yet.
锆合金与不锈钢的连接在核反应堆工程中是一项重要技术，目前还没有找到一种令人十分满意的方法。
In China, the study of FRP has been developed since the end of last century, and the technology of strengthening concrete structures with bonding exterior FRP is the focus of study.
我国于二十世纪九十年代后期开展FRP的研究应用工作，其中外部粘贴FRP片材加固混凝土结构技术是目前研究的重点和热点。
The paper mainly introduces raw material quality control, calculation of burden, stretch-draw force and elongation value, construction technology of non-bonding prestressed steel strand.
主要介绍无粘结预应力钢绞线的原材质量控制、配料、张拉力值、伸长值的计算及施工工艺。
The inherent disadvantages of conventional bonding and encapsulation technology restrict the range of application.
传统的微系统键合、封装技术由于其本身固有的缺点，限制了其应用范围。
The technology cuts down on process flow of bonding and molding, as well as been useful for cost saving.
这种技术减少了对工艺流程的粘接，成型，以及节约成本是有益的。
The essential technology to we'd K3 nickel-based super alloy using transition liquid diffusion bonding is described.
本文阐述了用过渡液相扩散连接方法焊接K3镍基铸造高温合金的基本工艺。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The technology can be used at complex microelectronic components on the shape of anodic bonding.
可以通过该技术对形状复杂的微电子元器件进行阳极键合。
Taking advantage of advanced SEM and TEM technology and modern TFD theory, explanation to microscope bonding mechanism of cold pressure welding was made.
利用近代界面及表面电子结构理论(改进的TFD理论)和现代先进分析测试技术对冷压焊结合的微观机理进行了分析。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
The loading structure, testing part and force sensors were all integrated on a single chip by bulk silicon technology and bonding process.
利用微机械体硅工艺及键合技术，把系统中的测试机构、加载机构以及力传感器集成在一个单一的芯片上。
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