In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对Q FN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.
来自电路板结合区的厚度分析，纳米尺度的厚度分析。
A bonding pad with an RFID chip disposed thereon is arranged at the central area of the pair of extended conductive arms.
一置晶座和一射频识别(RFID)晶片设置在其上，位于该对导线臂的中心。
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