The bonding pad of the circuit board is provided with the gap, the gap and the positioning hole are spaced by certain interval to avoid tin leaking.
在电路板的焊盘上开设缺口，该缺口与定位孔相距一定间隔，可避免出现漏锡。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
We are used is the import assembly glue can reached 750 degrees, and the brake pad bonding surface more than 80%.
我们使用的是进口的粘结胶可以达到750度，并且刹车片粘结面超过80%从而排除由于刹车片粘结不够而造成脱落。
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