In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。
Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.
来自电路板结合区的厚度分析，纳米尺度的厚度分析。
A bonding pad with an RFID chip disposed thereon is arranged at the central area of the pair of extended conductive arms.
一置晶座和一射频识别(RFID)晶片设置在其上，位于该对导线臂的中心。
At least one bonding pad in the one or more bonding pads does not connect any parts except the selected part in the said multiple parts.
所述一个或多个焊盘中的至少一个焊盘没有连接到所述多个器件中除所选器件之外的任何器件。
Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
The bonding pad of the circuit board is provided with the gap, the gap and the positioning hole are spaced by certain interval to avoid tin leaking.
在电路板的焊盘上开设缺口，该缺口与定位孔相距一定间隔，可避免出现漏锡。
This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
The ligating structure includes a channel (48) that is configured to receive a corrective device (16) therein and to restrict the corrective device from movement relative to the tooth bonding pad.
绑扎结构包括通道(48)，其配置以将矫正设备(16)接收于其中，并且限制矫正设备相对于牙结合垫的移动。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
We are used is the import assembly glue can reached 750 degrees, and the brake pad bonding surface more than 80%.
我们使用的是进口的粘结胶可以达到750度，并且刹车片粘结面超过80%从而排除由于刹车片粘结不够而造成脱落。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
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