Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Quality of quartz crystal wafer is determined by its electrical parameters, so it is of great importance to measure its parameters accurately in the process of manufacture.
石英晶片电参数决定了其产品质量优劣，因此在石英晶片生产加工过程中精确测试其电参数尤为重要。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
In the process of wafer polishing, the wafer surface could be damaged badly and fragment rate will increase sharply, because of the accumulation of stress and the mechanical action.
在硅片研磨过程中，由于应力的积累和剧烈的机械作用，硅片表面损伤严重，碎片率增加。
This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装（WL-CSP）工艺是在固态芯片尺寸玻璃外壳中装入芯片。
Wafer pairs with bonding interface being native oxide or thermal oxide have different bonding behavior in the annealing process, which were investigated and compared.
将硅本征氧化层与硅热氧化层两种键合界面在退火过程中的行为进行了理论分析与比较。
By the principle of reversal process, the formula of material removal rate (MRR) in wafer rotation grinding process is deduced. The relationship between MRR and the grinding parameters is given.
在反转法的原理上，建立了硅片自旋转磨削材料去除率的理论模型，推导了材料去除率公式，分析了磨削工艺参数与材料去除率的关系。
This article introduces the clean process of RCA for silicon wafer, and the design and apply in the manufacture of this kind of silicon wafer auto clean equipment.
主要介绍了半导体晶圆rca清洗工艺以及半导体晶圆自动清洗设备在生产中的结构设计和应用情况。
It represents creativity and practicability of wet bench in process modules and wafer servo motor transportation.
在工艺模块和伺服机械传送方面体现了湿法化学的独创性和实用性。
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
双面抛光已成为硅晶片的主要后续加工方法，但由于需要严格的加工条件，很难获得理想的超光滑表面。
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