Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。

youdao

Quality of quartz crystal wafer is determined by its electrical parameters, so it is of great importance to measure its parameters accurately in the process of manufacture.

石英晶片电参数决定了其产品质量优劣，因此在石英晶片生产加工过程中精确测试其电参数尤为重要。

youdao

Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.

晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。

youdao

In 2008, Trina is determined to "lower our module manufacturing costs through constant improvements in cell efficiencies, wafer thickness reduction, and manufacturing process innovation, " he added.

FORBES: Magazine Article

Initial wafer runs on 32-nanometer process node suggest a quick ramp to high yields in 2010 and minimal additional development outlays.

FORBES: Intelligent Investing

Bigger wafers mean more chips per wafer, and since a fair portion of the cost of a chip is in the process itself (the upfront development cost is another major piece), rather than the wafers, bigger wafers mean cheaper chips.

FORBES: Three Investments That Will Change The Technology Game