• And the slopes of characteristic line sections represent planarization of film surface.

    特征线段的斜率反映了薄膜表面的平面度。

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  • The sacrificial layer is removed through an etching process such as chemical mechanical planarization.

    该牺牲层是通过例如化学机械平面化的蚀刻工艺除去的。

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  • Using the polishing pad with grooves or rougher surfaces can increase the material removal and planarization rate.

    抛光垫粗糙的表面有利于提高材料去除率。

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  • The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.

    对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。

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  • The use of different barrier slurries for copper chemical mechanical planarization CMP creates a challenge for post-CMP cleaning.

    铜化学机械平面化不同阻挡层浆料的应用引起了铜CMP后清洗的问题。

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  • The conditioning ring polishing machining is used for ultra-precision planarization; and kinematical analysis on pitch polishing is carried out.

    修正环型抛光机用于超精密平面抛光,并对沥青抛光进行了运动学分析。

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  • Chemical mechanical planarization (CMP) has gained wide acceptance within the semiconductor industry as the preferred method for controlling wafer topography.

    化学机械抛光(CMP)在半导体工业内获得了广泛的赞同,对控制形貌起伏的硅片表面当作首选方法。

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  • At the present time, chemical mechanical planarization (CMP) is the most effective technology for global and local planarization of the wafer in IC manufacturing.

    目前,化学机械抛光技术(CMP)被认为是能够实现晶圆表面局部平坦化和全局平坦化的最佳方法。

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  • This paper introduces that we can reduce Within wafer nonuniformity (WIWNU) to achieve part and full planarization by distributing the speed of polishing head and polis.

    介绍了在化学机械抛光过程中,可以通过抛光头与抛光台运动速度关系优化配置,降低晶片表面不均匀度,从而更好地实现晶片局部和全局平坦化。

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  • However, the traditional CMP technology has some disadvantages and limitations. It is important to research and develop new planarization technology while improving the traditional CMP technology.

    然而,传统CMP技术还存在一定的缺点或局限性,人们在不断完善CMP技术的同时,也在不断探索和研究新的平坦化技术。

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  • However, the traditional CMP technology has some disadvantages and limitations. It is important to research and develop new planarization technology while improving the traditional CMP technology.

    然而,传统CMP技术还存在一定的缺点或局限性,人们在不断完善CMP技术的同时,也在不断探索和研究新的平坦化技术。

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