Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.
随着封装密度的进一步提高，其热失效问题也变得更加严重。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The batteries have to store a lot of energy in a small, light package, scoring high in a quality known as energy density.
新型电池必须在轻小的电池组里储存大量电能，在能量密度上表现出高评分。
This is another cost of pattern density: API users are often forced to accept or reject a whole package.
这是模式密集的另一个代价：API用户常常被迫接受或者拒绝整个包。
CASTEP is a software package which USES density functional theory to provide a good atomic-level description of all manner of materials and molecules.
CASTEP是使用密度的一个软件包裹提供对各种各样的材料和分子的好原子水平的描述的功能的理论。
The cotton shall be supplied in forms of universal density compressed package.
棉花须以通用密度压缩货包的形式供货。
The energy bands and density of states were calculated using the VASP(Vienna ab-initio simulation package) program.
在此基础上计算了化合物的能带结构和电子能态密度。
Secondly, the geometric structures, stability and electronic properties of carbon nanoscrolls are calculated by using the first principles density functional calculation package CASTEP.
其次，采用第一性原理密度泛函软件包CASTEP计了算碳纳米卷的几何结构、稳定性以及电子属性。
The volumetric weight of a shipment is a calculation that reflects the density of a package.
货物 体积重量是一种反映了包裹密度的计算结果。
The formation energy, phase diagram, voltage, crystal structural parameter and density of state can be calculated using VASP software package.
利用VASP软件包可计算形成能、相图、电压和材料的晶体结构参数及态密度等。
Through the analysis of the quality cost, we find two serious problems, (1) leakage of cream from aluminium pipe package and the density of syrup result in disqualification ;
然后通过进行质量成本分析，发现（1）膏剂铝管包装尾部漏油、中药糖浆剂密度问题对质量成本的影响很大；
This paper presents some types of high density package, describes their general constructions and also shows the outline standards of these packages.
本文叙述了高密度封装的类型，介绍了它们的一般结构，并提供了封装的外形标准。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
The designing and idea of developing top grade high counts and high density poplin fabrics are introduced, such as yarn selection, texture design, package dyeing, weaving and mercerizing process.
介绍了纯棉高支高密液氨潮交联免烫府绸面料的开发技术，如纱线选择、规格设计、筒子纱染色、织造和丝光工艺等；
The main elements to influence dyeing quality of package dyed yarn are detailedly introduced from the aspects of cheese shaping, winding density, dyeing equipment, water quality and dyestuffs purity.
从筒子纱的成形、染色设备、水质、染料纯度几方面对影响筒子纱染色质量的主要因素做了详细的介绍。
The higher lexical density indicates the higher lexical variation and the more efficient package of information into a text.
学术语篇的词语密度较高，也证明了有效地将信息展现在语篇当中。
The higher lexical density indicates the higher lexical variation and the more efficient package of information into a text.
学术语篇的词语密度较高，也证明了有效地将信息展现在语篇当中。
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