Along with the increase of package density, the issue of ASIC thermal failure has become more and more important.
随着封装密度的进一步提高，其热失效问题也变得更加严重。
With increase in electronic package density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高，板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
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