The chip is fabricated by using semiconductor technics and MEMS technics.
芯片利用半导体工艺和MEMS工艺制作。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
This task adopt MEMS technics to make Thermal -film air-mass sensor, mostly work is the study and facture of the sense organ of the chip.
本课题采用MEMS工艺制作热膜式气体质量流量传感器，主要工作放在敏感头芯片部分的研制。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
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