The chip is fabricated by using semiconductor technics and MEMS technics.
芯片利用半导体工艺和MEMS工艺制作。
This task adopt MEMS technics to make Thermal -film air-mass sensor, mostly work is the study and facture of the sense organ of the chip.
本课题采用MEMS工艺制作热膜式气体质量流量传感器，主要工作放在敏感头芯片部分的研制。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
Among numerous betterment technics, applying laser for bonding is a characteristic work, also is one of pop encapsulation researches, in which should pay more attention to application in biology MEMS.
在众多的改进工艺中，运用激光实现键合是颇具特色的一项工作，目前也是激光在封装研究领域的热点之一，特别值得关注的一个方向是激光键合在生物mems领域中的应用。
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